by Dallera, Claudia, Fracassi, Francesca, Braicovich, Lucio and Scarel, Giovanna, Wiemer, Claudia, Fanciulli, Marco, Pavia, Giuseppe and Cowie, Bruce C. C.
Abstract:
The authors present novel results on the interface between silicon and the high-kappa oxides Al2O3 and HfO2 grown by atomic layer deposition. The determination of the thickness of the interfacial layer between oxide and Si(100) is crucial to the evaluation of the performances of devices based on high-kappa dielectrics. They find through hard x-ray photoemission spectroscopy (HaXPES) that no interfacial layer forms between Al2O3 and Si(100) whereas almost one monolayer forms between HfO2 and Si(100). HaXPES does not involve any destructive procedure nor any sample preparation. High-energy photoemission could therefore be widely employed for the characterization of real devices. (c) 2006 American Institute of Physics.
Reference:
Nondestructive diagnostics of high-kappa dielectrics for advanced electronic devices (Dallera, Claudia, Fracassi, Francesca, Braicovich, Lucio and Scarel, Giovanna, Wiemer, Claudia, Fanciulli, Marco, Pavia, Giuseppe and Cowie, Bruce C. C.), In APPLIED PHYSICS LETTERS, AMER INST PHYSICS, volume 89, 2006.
Bibtex Entry:
@article{ ISI:000241757500138, Author = {Dallera, Claudia and Fracassi, Francesca and Braicovich, Lucio and Scarel, Giovanna and Wiemer, Claudia and Fanciulli, Marco and Pavia, Giuseppe and Cowie, Bruce C. C.}, Title = {{Nondestructive diagnostics of high-kappa dielectrics for advanced electronic devices}}, Journal = {{APPLIED PHYSICS LETTERS}}, Year = {{2006}}, Volume = {{89}}, Number = {{18}}, Month = {{OCT 30}}, Abstract = {{The authors present novel results on the interface between silicon and the high-kappa oxides Al2O3 and HfO2 grown by atomic layer deposition. The determination of the thickness of the interfacial layer between oxide and Si(100) is crucial to the evaluation of the performances of devices based on high-kappa dielectrics. They find through hard x-ray photoemission spectroscopy (HaXPES) that no interfacial layer forms between Al2O3 and Si(100) whereas almost one monolayer forms between HfO2 and Si(100). HaXPES does not involve any destructive procedure nor any sample preparation. High-energy photoemission could therefore be widely employed for the characterization of real devices. (c) 2006 American Institute of Physics.}}, Publisher = {{AMER INST PHYSICS}}, Address = {{1305 WALT WHITMAN RD, STE 300, MELVILLE, NY 11747-4501 USA}}, Type = {{Article}}, Language = {{English}}, Affiliation = {{Dallera, C (Corresponding Author), Politecn Milan, Dipartimento Fis, CNR, INFM, Piazza L da Vinci 32, I-20133 Milan, Italy. Politecn Milan, Dipartimento Fis, CNR, INFM, I-20133 Milan, Italy. CNR, INFM, MDM Natl Lab, I-20041 Agrate Brianza, MI, Italy. STMicroelectronics, I-20041 Agrate Brianza, MI, Italy. European Synchrotron Radiat Facil, F-38043 Grenoble, France.}}, DOI = {{10.1063/1.2374843}}, Article-Number = {{183521}}, ISSN = {{0003-6951}}, EISSN = {{1077-3118}}, Keywords-Plus = {{ATOMIC-LAYER-DEPOSITION; OXIDE THIN-FILMS; ELECTRICAL-PROPERTIES; SI; MECHANISM; INSULATOR; SYSTEMS; AL2O3; ZRO2}}, Research-Areas = {{Physics}}, Web-of-Science-Categories = {{Physics, Applied}}, Author-Email = {{claudia.dallera@fisi.polimi.it}}, ResearcherID-Numbers = {{Wiemer, Claudia/AAG-1979-2019 Fanciulli, Marco/J-9940-2013 }}, ORCID-Numbers = {{Fanciulli, Marco/0000-0003-2951-0859 Wiemer, Claudia/0000-0001-9975-0458 Braicovich, Lucio/0000-0001-6548-9140 Pavia, Giuseppe/0000-0002-3730-5161}}, Number-of-Cited-References = {{28}}, Times-Cited = {{9}}, Usage-Count-Last-180-days = {{0}}, Usage-Count-Since-2013 = {{10}}, Journal-ISO = {{Appl. Phys. Lett.}}, Doc-Delivery-Number = {{101RG}}, Unique-ID = {{ISI:000241757500138}}, DA = {{2020-12-22}}, }
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